Polymicro 200/230 PolyClad Fiber 200μm HPCF for Data-Communications Crimp and Cleave Compatible

CHARACTERISTICS

– Step index

– Low –OH, synthetic fused silica core,

  PolyClad™ hard polymer clad, ETFE buffer or jacket

– Broad operating wavelength range, 

  optimized at 650 and 850nm

– Minimal connector offsets due to high 

  clad/core diameter ratio

– High tensile strength and minimal bend

  radius for high reliability

– Crimp/cleave and epoxy/polish compatible

– Large core and high na provides 

  easy termination and high coupling

  efficiency to light source

– Chemically resistant

– Flame retardant

– Short-to-medium distance data communications 

  for factory automation and process control

– ROHS compliant