---
title: "Polymicro 200/230 PolyClad Fiber 200μm HPCF for Data-Communications Crimp and Cleave Compatible"
url: "https://bmlaser.co.kr/polymicro-200-230-polyclad-fiber-200%ce%bcm-hpcf-for-data-communications-crimp-and-cleave-compatible/"
description: "CHARACTERISTICS Step index Low –OH, synthetic fused silica core, PolyClad™ hard polymer clad, ETFE buffer or jacket Broad operating wavelength range, optimized at 650 and 850nm Minimal connector offsets due to high clad/"
image: "https://bmlaser.co.kr/wp-content/uploads/2021/04/585_shop1_917774.jpg"
type: "Article"
datePublished: "2021-04-13T14:38:25+00:00"
dateModified: "2021-04-16T01:00:33+00:00"
---

# Polymicro 200/230 PolyClad Fiber 200μm HPCF for Data-Communications Crimp and Cleave Compatible

CHARACTERISTICS - Step index - Low –OH, synthetic fused silica core, PolyClad™ hard polymer clad, ETFE buffer or jacket - Broad operating wavelength range, optimized at 650 and 850nm - Minimal connector offsets due to high clad/core diameter ratio - High tensile strength and minimal bend radius for high reliability - Crimp/cleave and epoxy/polish compatible - Large core and high na provides easy termination and high coupling efficiency to light source - Chemically resistant - Flame retardant - Short-to-medium distance data communications for factory automation and process control - ROHS compliant